Ravi Ramya, Indian Institute of Technology Madras, Chennai, TN, India; Chandrasekharan Rajendran, Indian Institute of Technology Madras, Chennai, TN, India; Hans Ziegler, Universitát Passau, Passau, G / 2019-01-23 / Springer Berlin Heidelberg
George Q. Huang, The University of Hong Kong, Hong Kong, Hong Kong; Chen-Fu Chien, National Tsing Hua University, Hsinchu, Taiwan; Runliang Dou, Tianjin University, Tianjin, China / 2019-01-15 / Springer Singapore
Athiqah Nur Alami, Indonesian Institute of Sciences, Jakarta, Indonesia; Ganewati Wuryandari, Indonesian Institute of Sciences, Jakarta, Indonesia; R.R Emilia Yustiningrum, Indonesian Institute of Sci / 2018-12-12 / Springer Berlin Heidelberg
Kaveh Rajab Khalilpour, University of Sydney School of Chemical and Biomolecular Engineering, Sydney, NSW, Australia; Anthony Vassallo, University of Sydney, School of Chemical & Biomolecular Engineer / 2018-12-11 / Springer Berlin Heidelberg
Seema Bathla, Jawaharlal Nehru University , New Delhi, India; Amaresh Dubey, Jawaharlal Nehru University, New Delhi, India / 2018-12-11 / Springer Berlin Heidelberg
Shubhabrata Datta, SRM Institute of Science and Technology, Chennai, India; J. Paulo Davim, University of Aveiro, Aveiro, Portugal / 2018-11-13 / Springer Berlin Heidelberg
Leonid Chechurin, Lappeenranta University of Technology, Lappeenranta, Finland; Mikael Collan, Lappeenranta University of Technology, Lappeenranta, Finland / 2018-11-12 / Palgrave Macmillan
Murugan Anandarajan, Drexel University, Philadelphia, PA, USA; Chelsey Hill, Montclair State University, Montclair, NJ, USA; Thomas Nolan, Mercury Data Science, Houston, TX, USA / 2018-11-03 / Springer Berlin Heidelberg
Timo Särkkä, University of Jyväskylä, Jyväskylä, Finland; Miquel Gutiérrez-Poch, University of Barcelona, Barcelona, Spain; Mark Kuhlberg, Laurentian University, Sudbury, ON, Canada / 2018-11-03 / Springer Berlin Heidelberg
Jessica Fox, Electric Power Research Institute, Palo Alto, CA, USA; Morgan Scott, Electric Power Research Institute, Washington, DC, , USA / 2018-11-01 / Springer Berlin Heidelberg