More-than-Moore Devices and Integration for Semiconductors

*摩尔的器件与半导体集成

工程热物理

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出  版 社
出版时间
2024年02月18日
装      帧
平装
ISBN
9783031216121
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页      码
260
开      本
9.25 x 6.10 x 0.00
语      种
英文
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图书简介
This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems;Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources;Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.
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