Microelectronics Packaging Handbook:Technology Drivers Part I

工程热物理

售   价:
2996.00
发货周期:外国库房发货,通常付款后3-5周到货
作      者
出  版 社
出版时间
1997年01月31日
装      帧
精装
ISBN
9780412084317
复制
页      码
720
开      本
语      种
英文
版      次
2nd Ed.
综合评分
暂无评分
我 要 买
- +
库存 94 本
  • 图书详情
  • 目次
  • 买家须知
  • 书评(0)
  • 权威书评(0)
图书简介
Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow’s computing and communications systems. Electronic packaging is defined as interconnection. powering, cool­ ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
本书暂无推荐
本书暂无推荐
看了又看
  • 上一个
  • 下一个