Polymeric Thermosetting Compounds:Innovative Aspects of Their Formulation Technology

图书简介

Engineering design teams sometimes have need of a material that may not exist because the combination of required properties is difficult to achieve. One solution is to develop a new material having the required set of properties needed in the application. During his 40-year career, author Ralph Hermansen has successfully worked on many such problems. In this book he presents twenty of those design problems and the solutions, which resulted in patents and spin-off applications. He draws on his years of hands-on experience to cover polymeric compounds such as coatings, adhesives, encapsulants, transparent plastics, and others.

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Harvard Library

Preface. Custom Formulating . Materials and Process Engineering. The Art and Science of Formulating. Thermal Transfer Adhesives for Space Electronics . Thermal-Transfer Filleting Adhesives. Flexible Epoxy Thermal-Transfer Adhesives for Flatpacks. More About the New Thermal Transfer Adhesives. Superior Thermal Transfer Adhesive. Other Custom-Formulated Compounds for Aerospace Electronics Applications. Radio-Opaque Adhesive/Sealant. Low Exotherm, Low-Temperature-Curing Epoxy Impregnants. Platable Adhesives for Cyanate Ester Composites. Reworkable, Thermally-Conductive Adhesives for Electronic Assemblies. Room-Temperature-Stable, One-Component, Flexible Epoxy Adhesives. Custom-Formulated Compounds for Automotive Electronics Applications . Air Bag Sensor Encapsulation. Reactive Hot Melt Conformal Coating Materials. Solder Joint Lead Encapsulation. Custom-Formulated Organic Solder to Eliminate Lead . Formulation of a Drop-Resistant Organic Solder. Rigid Polyurethanes for Aircraft Transparencies. Sierraclad? Bird-Proof Canopies and Windshields. Three Niche Technologies. Flexipoxy Technology. Hacthane Technology. Transparent Polyurethane Plastics. Spin-Off Applications . Spin-off from Our Thermal Transfer Adhesives Patents. Spin-off from Our Electrically-Conductive Adhesives Patents. Spin-off from Our Encapsulants, Potting Compounds and Impregnants Patents. Spin-Off from Our High Volume Electronic Assembly Materials Patents. Spin-off from Our Specialty Adhesives Patents. Spin-off from Our Specialty Rigid Thermosets Patents. Appendix I: The Science of Rubbery Materials. Index.

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Polymeric Thermosetting Compounds:Innovative Aspects of Their Formulation Technology 热固性高分子化合物：配方技术的创新 材料科学基础学科

Polymeric Thermosetting Compounds:Innovative Aspects of Their Formulation Technology

热固性高分子化合物：配方技术的创新
材料科学基础学科