Hybrid Assemblies and Multichip Modules(Manufacturing Engineering and Materials Processing)

电子技术

原   价:
1986.00
售   价:
1589.00
优惠
平台大促 低至8折优惠
发货周期:预计5-7周发货
作      者
出  版 社
出版时间
1992年12月16日
装      帧
精装
ISBN
9780824784669
复制
页      码
296
开      本
8-1/2 x 11
语      种
英文
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库存 97 本
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图书简介
Providing a description of design considerations from the user’s viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.
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