图书简介
Symposium S, ?Microelectromechanical Systems - Materials and Devices IV?, held November 29?December 3 at the 2010 MRS Fall Meeting in Boston, Massachusetts, focused on micro- and nanoelectromechanical systems (MEMS/NEMS), technologies which were spawned from the fabrication and integration of small-scale mechanical, electrical, thermal, magnetic, fluidic and optical sensors and actuators with micro-electronic components.
Part I. Material Development and Optimization: 1. Biodegradable microfluidic scaffolds with tunable degradation properties from amino alcohol-based poly(ester amide) elastomers Jane Wang; 2. Measurements of resonance frequency of parylene microspring arrays using atomic force microscopy Churamani Gaire; 3. Gold in flux-less bonding: noble or not noble Marco Balucani; 4. Giant piezoresistive variation of metal particles dispersed in PDMS matrix Stefano Stassi; 5. Characterization of Group III-nitride based surface acoustic wave devices for high temperature applications J. Justice; 6. Transport model for microfluidic device for cell culture and tissue development Niraj Inamdar; 7. Refractive index memory effect of ferroelectric materials by domain control Kazuhiko Inoue; 8. Synthesis and control of ZnS nanodots and nanorods with different crystalline structure from an identical raw material solution and the excitonic UV emission Masato Uehara; 9. Improving PZT thin film texture through Pt metallization and seed layers Luz Sanchez; Part II. Process Integration: 10. Patterning nanomaterials on fragile micromachined structures using electron beam lithography Srikar Vengallatore; 11. Pt/TiO2 growth templates for enhanced PZT films and MEMS devices Daniel Potrepka; 12. Contact resistivity of laser annealed SiGe for MEMS structural layers deposited at 210癈 Joumana El-Rifai; 13. PZT thick films for 100 MHz ultrasonic transducers fabricated using chemical solution deposition process Naoto Kochi; 14. Reliability and stability of thin-film amorphous silicon MEMS on glass substrates Pedro Sousa; 15. High yield polymer MEMS process for CMOS/MEMS integration V. Seena; 16. Characterization of textured PZT thin films prepared by sol-gel method onto stainless steel substrates Xuelian Zhao; Part III. Micro- and Nanosensors: 17. A picowatt energy harvester Joseph Evans; 18. Mechanical and material characterization of bilayer microcantilever-based IR detectors Xin Zhang; 19. Film conductivity controlled variation of the amplitude distribution of high-temperature resonators Silja Schmidtchen; 20. Ultrafine silicon nano-wall hollow needles and applications in inclination sensor and gas transport Zeinab Sanaee; 21. Development of a robust design for wet etched co-integrated pressure sensor systems Reinhart Job; 22. SU8/modified MWNT composite for piezoresistive sensor application V. Seena; 23. Thin film amorphous silicon bulk-mode disk resonators fabricated on glass substrates Alexandra Gualdino; 24. Fabrication and characterization of MEMS-based structures from a bio-inspired, chemo-responsive polymer nanocomposite Allison Hess; Part IV. Material and Device Reliability: 25. Characterizing the effect of uniaxial strain on the surface roughness of Si nanowire MEMS-based microstructures Enrique Escobedo-Cousin; 26. Mechanism of hole inlet closure in shape transformation of hole arrays on Si(001) substrates by hydrogen annealing Reiko Hiruta; 27. Characterisation of hydrophobic forces in liquid self assembly of micron sized functional building blocks Maurizio Gullo; 28. Nanoindentation characterization of PECVD silicon nitride on silicon subjected to mechanical fatigue loading Kuo-Shen Chen; 29. Effect of phosphorus doping on the Young?s modulus and stress of polysilicon thin films Elena Bassiachvili; 30. Residual stress in sputtered silicon oxycarbide thin films Xin Zhang; 31. Solid bridging during pattern collapse (stiction) studied on silicon nanoparticles Daniel Peter; 32. Fabrication and characterization of two compliant electrical contacts for MEMS: gallium microdroplets and carbon nanotube turfs Yoonkap Kim.
Trade Policy 买家须知
- 关于产品:
- ● 正版保障:本网站隶属于中国国际图书贸易集团公司,确保所有图书都是100%正版。
- ● 环保纸张:进口图书大多使用的都是环保轻型张,颜色偏黄,重量比较轻。
- ● 毛边版:即书翻页的地方,故意做成了参差不齐的样子,一般为精装版,更具收藏价值。
关于退换货:
- 由于预订产品的特殊性,采购订单正式发订后,买方不得无故取消全部或部分产品的订购。
- 由于进口图书的特殊性,发生以下情况的,请直接拒收货物,由快递返回:
- ● 外包装破损/发错货/少发货/图书外观破损/图书配件不全(例如:光盘等)
并请在工作日通过电话400-008-1110联系我们。
- 签收后,如发生以下情况,请在签收后的5个工作日内联系客服办理退换货:
- ● 缺页/错页/错印/脱线
关于发货时间:
- 一般情况下:
- ●【现货】 下单后48小时内由北京(库房)发出快递。
- ●【预订】【预售】下单后国外发货,到货时间预计5-8周左右,店铺默认中通快递,如需顺丰快递邮费到付。
- ● 需要开具发票的客户,发货时间可能在上述基础上再延后1-2个工作日(紧急发票需求,请联系010-68433105/3213);
- ● 如遇其他特殊原因,对发货时间有影响的,我们会第一时间在网站公告,敬请留意。
关于到货时间:
- 由于进口图书入境入库后,都是委托第三方快递发货,所以我们只能保证在规定时间内发出,但无法为您保证确切的到货时间。
- ● 主要城市一般2-4天
- ● 偏远地区一般4-7天
关于接听咨询电话的时间:
- 010-68433105/3213正常接听咨询电话的时间为:周一至周五上午8:30~下午5:00,周六、日及法定节假日休息,将无法接听来电,敬请谅解。
- 其它时间您也可以通过邮件联系我们:customer@readgo.cn,工作日会优先处理。
关于快递:
- ● 已付款订单:主要由中通、宅急送负责派送,订单进度查询请拨打010-68433105/3213。
本书暂无推荐
本书暂无推荐