Lead-Free Solder Process Development

无铅焊锡工艺开发

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原   价:
1373.00
售   价:
1098.00
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平台大促 低至8折优惠
发货周期:预计3-5周发货
作      者
出  版 社
出版时间
2011年01月28日
装      帧
精装
ISBN
9780470410745
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页      码
284
语      种
英文
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图书简介
"Lead-free Solder Process Development," covers a list of key topics including: legislation, soldering fluxes, SMT, wave, rework, alloys, component finishes, reliability, EDXRF, and standards. It is intended as a reference guide to engineers in the industry who are or who will be migrating to lead-free soldering. It is not intended to be an exhaustive review of the literature but to be a practical reference guide for selected, key subject areas. Each subject area is discussed by those who have conducted work in the field and can pr
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Princeton University Library
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