Photonic Packaging Sourcebook

光子包装资料大全:适合光学元件、基本计算与模块的光纤耦合芯片

光电子学与激光技术

原   价:
1658.00
售   价:
1326.00
优惠
平台大促 低至8折优惠
出  版 社
出版时间
2015年04月15日
装      帧
精装
ISBN
9783642253751
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页      码
344
语      种
英语
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图书简介
This book serves as a guide on photonic assembly techniques. It provides an overview of today’s state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.
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