Chemical-Mechanical Planarization

化学机械平坦化

材料表面与界面

原   价:
438.00
售   价:
350.00
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平台大促 低至8折优惠
发货周期:预计5-7周发货
出  版 社
出版时间
2014年06月15日
装      帧
平装
ISBN
9781107409415
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页      码
364
语      种
英语
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图书简介
Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.
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