Multi-Chip Module Test Strategies

工程热物理

售   价:
884.00
作      者
出  版 社
出版时间
1997年05月15日
装      帧
精装
ISBN
9780792399209
复制
页      码
167
语      种
英语
综合评分
暂无评分
我 要 买
- +
库存 56 本
  • 图书详情
  • 目次
  • 买家须知
  • 书评(0)
  • 权威书评(0)
图书简介
MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
本书暂无推荐
本书暂无推荐
看了又看
  • 上一个
  • 下一个