Helmut Tschöke; Michael Arndt; Michael Baade; René Berndt; Frank Bunar; Boris Bunel; Gernot Graf; Markus Grubmüller; Helmut Jansen; Dieter Köhler; Elisa-Maria Moser; Lukas Walter; Roland Wanker; Fried / 2019-01-01 / Springer Fachmedien Wiesbaden
Huafeng Yu, Boeing Research and Technology, Huntsville, AL, USA; Xin Li, Duke University, Durham, NC, USA; Richard M. Murray, California Institute of Technology, Pasadena, CA, USA; S. Ramesh, General / 2018-11-22 / Springer Berlin Heidelberg
Kaushik Saha, Indian Institute of Technology Delhi, New Delhi, India; Avinash Kumar Agarwal, Indian Institute of Technology Kanpur, Kanpur, India; Koushik Ghosh, Jadavpur University, Kolkata, India; / 2018-11-19 / Springer Berlin Heidelberg
Shantanu Bhattacharya, Indian Institute of Technology Kanpur, Kanpur, India; Avinash Kumar Agarwal, Indian Institute of Technology Kanpur, Kanpur, India; Om Prakash, Indian Institute of Technology Kan / 2018-11-15 / Springer Berlin Heidelberg
Hari Vasudevan, Dwarkadas J. Sanghvi College of Engineering, Mumbai, India; Vijaya Kumar N. Kottur, Dwarkadas J. Sanghvi College of Engineering, Mumbai, India; Amool A. Raina, RWTH Aachen University, / 2018-11-05 / Springer Berlin Heidelberg
Nicolae Burnete, Technical University of Cluj-Napoca, Cluj-Napoca, Romania; Bogdan Ovidiu Varga, Technical University of Cluj-Napoca, Cluj-Napoca, Romania / 2018-09-30 / Springer Berlin Heidelberg