Jacob Benesty, University of Quebec, Montreal, QC, Canada; Israel Cohen, Technion—Israel Institute of Technology, Haifa, Israel; Jingdong Chen, Northwestern Polytechnical University, Xi’an, China / 2019-03-08 / Springer Berlin Heidelberg
Warren J. Gross, McGill University, Montr閍l, QC, Canada; Vincent C. Gaudet, University of Waterloo, Waterloo, ON, Canada / 2019-03-04 / Springer Berlin Heidelberg
Robert LeMoyne, Northern Arizona University, Flagstaff, AZ, USA; Timothy Mastroianni, Independent, Pittsburgh, PA, USA; Donald Whiting, Allegheny Health Network Neuroscience Institute, Pittsburgh, PA, / 2019-03-04 / Springer Berlin Heidelberg
Dagmar Cagáová, Slovak University of Technology in Bratislava, Trnava, Slovakia; Michal Balog, Technical University of Koice, Preov, Slovakia; Lucia Knapíková, Technical University of Koice, Pre / 2019-03-01 / Springer Berlin Heidelberg
Shoichi Ishihara (Professor, Osaka Institute of Technology, Japan); Shunsuke Kobayashi (Professor Emeritus, Tokyo University of Agriculture and Technology (TUAT), Japan); Yasuhiro Ukai (Technical Cons / 2019-03-01 / Institution of Engineering and Technology (IET)
Shoichi Ishihara (Professor, Osaka Institute of Technology, Japan); Shunsuke Kobayashi (Professor Emeritus, Tokyo University of Agriculture and Technology (TUAT), Japan); Yasuhiro Ukai (Technical Cons / 2019-03-01 / Institution of Engineering and Technology (IET)
Surekha Borra, K.S. Institute of Technology, Bengaluru, India; Rohit Thanki, C. U. Shah University, Wadhwan city, India; Nilanjan Dey, Techno India College of Technology, Kolkata, India / 2019-02-21 / Springer Berlin Heidelberg
Zipeng Li, Intel (United States), Santa Clara, CA, USA; Krishnendu Chakrabarty, Duke University, Durham, NC, USA; Tsung-Yi Ho, National Tsing Hua University, Hsinchu, Taiwan; Chen-Yi Lee, National Chi / 2019-02-21 / Springer Berlin Heidelberg
Iraj Sadegh Amiri, Ton Duc Thang University, Ho Chi Minh City, Vietnam; Hossein Mohammadi, Pasargad Higher Education Institute, Shiraz, Iran; Mahdiar Hosseinghadiry, Allseas Engineering, DELFT, The Ne / 2019-02-20 / Springer Berlin Heidelberg
Soumya Sen, University of Calcutta, Kolkata, India; Anjan Dutta, Techno India College of Technology, Kolkata, India; Nilanjan Dey, Techno India College of Technology, Kolkata, India / 2019-02-20 / Springer Berlin Heidelberg
Iraj Sadegh Amiri, Ton Duc Thang University, Ho Chi Minh City, Vietnam; Masih Ghasemi, Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, Selangor, Malaysia / 2019-02-18 / Springer Berlin Heidelberg
Zi-Hui Zhang, Hebei University of Technology, Tianjin, China; Chunshuang Chu, Hebei University of Technology, Tianjin, China; Kangkai Tian, Hebei University of Technology, Tianjin, China; Yonghui Zhan / 2019-02-18 / Springer Berlin Heidelberg
Deven N. Trivedi, G. H. Patel College of Engineering and Technology, Vallabh Vidyanagar, India; Nimit D. Shah, C. U. Shah University, Wadhwan City, India; Ashish M. Kothari, Atmiya Institute of Techno / 2019-02-15 / Springer Berlin Heidelberg
Utpal Biswas, University of Kalyani, Kalyani, India; Amit Banerjee, National University of Singapore, Singapore, Singapore; Sukhomay Pal, Indian Institute of Technology Guwahati, Guwahati, India; Arin / 2019-02-15 / Springer Berlin Heidelberg
Rachel Pflieger, University of Montpellier, ENSCM, Bagnols-sur-Cèze Cedex, France; Sergey I. Nikitenko, University of Montpellier, ENSCM, Bagnols-sur-Cèze Cedex, France; Carlos Cairós, University of L / 2019-02-14 / Springer Berlin Heidelberg
Daniel Thalmann, EPFL, Lausanne, Switzerland; N Subhashini, VIT University, Chennai, India; K. Mohanaprasad, VIT University, Chennai, India; M S Bala Murugan, VIT University, Chennai, India / 2019-02-14 / Springer Berlin Heidelberg
N. R. Shetty, Nitte Education Trust, Bengaluru, India; L. M. Patnaik, National Institute of Advanced Studies, Bengaluru, India; N. H. Prasad, Nitte Meenakshi Institute of Technology, Bengaluru, India; / 2019-02-14 / Springer Berlin Heidelberg
Akhtar Kalam, Victoria University, Melbourne, VIC, Australia; Swagatam Das, Indian Statistical Institute, Kolkata, India; Kalpana Sharma, Sikkim Manipal Institute of Technology, Rangpo, India / 2019-02-11 / Springer Berlin Heidelberg