Taofeek Orekan, University of Connecticut, Storrs, CT, USA; Peng Zhang, University of Connecticut, Storrs, CT, USA / 2019-01-28 / Springer Berlin Heidelberg
Claudio Madeddu, Dipartimento di Ingegneria Meccanica, Chimica e dei Materiali, Università di Cagliari, Cagliari, Italy; Massimiliano Errico, Department of Chemical Engineering, Biotechnology and Envi / 2019-01-28 / Springer Berlin Heidelberg
Stephen Jia Wang, Royal College of Art, Kensington Gore, London, UK; Patrick Moriarty, Monash University-Caulfield Campus, Caulfield East, VIC, Australia / 2019-01-26 / Springer Berlin Heidelberg
Erik Cuevas, Universidad de Guadalajara, Guadalajara, Mexico; Emilio Barocio Espejo, Universidad de Guadalajara, Guadalajara, Mexico; Arturo Conde Enríquez, Universidad Autónoma de Nuevo León, San Nic / 2019-01-24 / Springer Berlin Heidelberg
Riccardo Basosi, University of Siena, Siena, Italy; Maurizio Cellura, University of Palermo, Palermo, Italy; Sonia Longo, University of Palermo, Palermo, Italy; Maria Laura Parisi, University of Siena / 2019-01-24 / Springer Berlin Heidelberg
D. Srinivasacharya, National Institute of Technology Warangal, Warangal, India; K. Srinivas Reddy, Indian Institute of Technology Madras, Chennai, India / 2019-01-19 / Springer Berlin Heidelberg
Antonio Colmenar Santos Enrique Rosales Asensio and David Borge Diez (Industrial En Spanish University for Distance Education (UNED) / 2019-01-18 / Nova Science Publishers
Ángel Arcos-Vargas, University of Seville, Sevilla, Spain; Laureleen Riviere, University of Seville, Sevilla, Spain / 2019-01-17 / Springer Berlin Heidelberg
Md. Rabiul Islam Rajshahi University of Engineering Naruttam Kumar Roy Khulna University of Engineering Saifur Rahman Virginia / 2019-01-12 / Springer Berlin Heidelberg
Giuseppe Grazzini, University of Florence, Florence, Italy; Adriano Milazzo, University of Florence, Florence, Italy; Federico Mazzelli, University of Florence, Florence, Italy / 2019-01-12 / Springer Berlin Heidelberg
Sudipta De, Jadavpur University, Kolkata, India; Santanu Bandyopadhyay, Indian Institute of Technology Bombay, Mumbai, India; Mohsen Assadi, University of Stavanger, Stavanger, Norway; Deb A Mukherjee / 2019-01-12 / Springer Berlin Heidelberg
Sudipta De, Jadavpur University, Kolkata, India; Santanu Bandyopadhyay, Indian Institute of Technology Bombay, Mumbai, India; Mohsen Assadi, University of Stavanger, Stavanger, Norway; Deb A Mukherjee / 2019-01-12 / Springer Berlin Heidelberg
Tharangika Bambaravanage, University of Moratuwa Department of Electrical Engineering, Moratuwa, Sri Lanka; Asanka Rodrigo, University of Moratuwa Department of Electrical Engineering, Moratuwa, Sri L / 2019-01-12 / Springer Berlin Heidelberg
Prasad Kaparaju, Griffith University, Brisbane, QLD, Australia; Robert J. Howlett, Bournemouth University and KES International, Shoreham-by-sea, UK; John Littlewood, Cardiff Metropolitan University, / 2019-01-09 / Springer Berlin Heidelberg
Santanu De, Indian Institute of Technology Kanpur, Kanpur, India; Avinash Kumar Agarwal, Indian Institute of Technology Kanpur, Kanpur, India; V. S. Moholkar, Indian Institute of Technology Guwahati, / 2019-01-04 / Springer Berlin Heidelberg
Ahmad Vasel, Tennessee Tech University, Cookeville, TN; David S.-K. Ting, University of Windsor, Windsor, ON, Canada / 2018-12-31 / Springer Berlin Heidelberg