K. V. Anisimov, GmbH RusOnyx, Moscow, Russia; A. V. Dub, JSC Science and Innovations, Moscow, Russia; S. K. Kolpakov, JSC Interdepartmental analytical Center, Moscow, Russia; A. V. Lisitsa, Orekho / 2019-01-04 / Springer Berlin Heidelberg
Jayeeta Chattopadhyay, Amity University, Ranchi, India; Rahul Singh, Amity University, Ranchi, India; Om Prakash, National Institute of Technology, Patna, Patna, India / 2019-01-01 / Springer Berlin Heidelberg
Changsheng Liu, East China University of Science and Technology, Shanghai, China; Hongyan He, East China University of Science and Technology, Shanghai, China / 2018-12-28 / Springer Berlin Heidelberg
Christophe Labbé, École Nationale Supérieure d’ingénieurs, Caen, France; Subhananda Chakrabarti, Indian Institute of Technology Bombay, Mumbai, India; Gargi Raina, VIT University, Vellore, Vellore, In / 2018-12-25 / Springer Berlin Heidelberg
Erkki Niemi, Lappeenranta University of Technology, Lappeenranta, Finland; Wolfgang Fricke, Hamburg University of Technology, Hamburg, Germany; Stephen J. Maddox, The Welding Institute, Cambridge / 2018-12-23 / Springer Berlin Heidelberg
Susheel Kalia, Indian Military Academy, Dehradun, India; Krzysztof Pielichowski, Cracow University of Technology , Kraków, Poland / 2018-12-12 / Springer Berlin Heidelberg
S.R.S Prabaharan, VIT University, Chennai, India; Nadia Magnenat Thalmann, Nanyang Technological University (NTU), Singapore, Singapore; V. S Kanchana Bhaaskaran, VIT University, Chennai, India / 2018-12-09 / Springer Berlin Heidelberg
Guozhen Shen, Institute of Semiconductors Chinese Academy of Sciences, Beijing, China; Yu-Lun Chueh, National Tsing-Hua University, Taiwan, China / 2018-12-05 / Springer Singapore
Satyajit Ratha, Indian Institute of Technology Bhubaneswar, Bhubaneswar, India; Aneeya Kumar Samantara, National Institute of Science Education and Research, Khurda, India / 2018-12-03 / Springer Berlin Heidelberg