Solder Materials(Advanced Integration and Packaging)

焊接材料

电子技术

原   价:
1608.00
售   价:
1206.00
发货周期:预计3-5周发货
作      者
出  版 社
出版时间
2018年07月13日
装      帧
精装
ISBN
9789813237605
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页      码
350
语      种
英文
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库存 30 本
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图书简介
This book provides comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the materials science of solders, in performing fundamental research, in carrying practical applications. This book can also serve as source book for literature search of the various important subjects. Key Features: oComprehensive overview of important solder subjects oCover important subjects of concern to research and industry application oComprehensive documentation of literatures
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