COOLING OF MICROELECTRONIC AND NANOELECTRONIC EQUIPMENT:ADVANCES AND EMERGING RESEARCH(WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING)

微电子及纳米电子设备的冷却:研究进展及新兴研究

工业工程学

原   价:
1852.00
售   价:
1389.00
发货周期:预计3-5周发货
作      者
出  版 社
出版时间
2014年08月27日
装      帧
精装
ISBN
9789814579780
复制
页      码
472
语      种
英文
综合评分
暂无评分
我 要 买
- +
库存 30 本
  • 图书详情
  • 目次
  • 买家须知
  • 书评(0)
  • 权威书评(0)
图书简介
To celebrate Professor Avi Bar-Cohen’s 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.
馆藏图书馆
Harvard Library
本书暂无推荐
本书暂无推荐
看了又看
  • 上一个
  • 下一个