U. Chandrasekhar, Vel Tech Rangarajan Dr. Sagunthala R&D Institute of Science and Technology, Avadi, Chennai, India; Lung-Jieh Yang, Tamkang University, Tamsui District, New Taipei City, Taiwan; S. Go / 2019-01-01 / Springer Berlin Heidelberg
H. Paul Urbach, Delft University of Technology, Delft, The Netherlands; Qifeng Yu, National University of Defense Technology, Changsha, China / 2018-10-06 / Springer Berlin Heidelberg
S閞gio M. O. Tavares, Universidade do Porto, Porto, Portugal; Paulo M. S. T. de Castro, Universidade do Porto, Porto, Portugal / 2018-08-14 / Springer Berlin Heidelberg
Josep M. Trigo-Rodríguez, Institute of Space Sciences, Bellaterra Barcelona, Spain; Maria Gritsevich, University of Helsinki, Helsinki, Finland; Herbert Palme, Senckenberg, Naturmuseum und Forschungsi / 2018-07-04 / Springer Berlin Heidelberg
Marco Aliberti, European Space Policy Institute, Vienna, Austria; Ksenia Lisitsyna, European Space Policy Institute, Vienna, Austria / 2018-06-25 / Springer Berlin Heidelberg
Luigi T. De Luca, Politecnico di Milano, Milan, Italy; Toru Shimada, Japan Aerospace Exploration Agency (JAXA), Sagamihara; Valery P. Sinditskii, Mendeleev University of Chemical Technology, Moscow, R / 2018-06-09 / Springer Berlin Heidelberg
Russell Wanhill, Independent Consultant, Emmeloord, The Netherlands; Michael Windisch, MT Aerospace AG, Augsburg, Germany / 2018-06-04 / Springer Berlin Heidelberg
Robert Sharman, National Center for Atmospheric Research, Boulder, CO, USA; Todd Lane, The University of Melbourne, Melbourne, VIC, Australia / 2018-05-31 / Springer Berlin Heidelberg
James De Clerck, Michigan Technological University Mechanical Engineering, Houghton, MI, USA; David S. Epp, Sandia National Laboratory , Albuquerque, / 2018-05-31 / Springer Berlin Heidelberg
Gerard Gómez, Institut d’Estudis Espacials de Catalunya and , Barcelona, Spain; Josep J. Masdemont, Institut d’Estudis Espacials de Catalunya and, Barcelona, Spain / 2018-05-30 / Springer Berlin Heidelberg
Evro Wee Sit, Svcommunity com, Hermosa Beach, CA, USA; Chad Walber, PCB Piezotronics, Inc, Depew, NY, USA; Patrick Walter, Texas Christian University, Fort Worth, TX, USA; Alfred Wicks, Virginia Polyt / 2018-05-25 / Springer Berlin Heidelberg