Mechatronic Modeling and Simulation Using Bond Graphs

利用键合图进行机电建模与模拟

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售   价:
1642.00
发货周期:预计5-7周发货
作      者
出  版 社
出版时间
2009年03月17日
装      帧
精装
ISBN
9781420073140
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页      码
504
开      本
6-1/8x9-1/4
语      种
英文
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图书简介
As a subject of interdisciplinary focus, mechatronics continues to emerge as an essential area of study across all of engineering. After introducing the concepts of mechatronic systems, this text delves into the modeling and building of such systems. The author, a leading instructor and developer of process models in manufacturing and automotive engineering, employs the Bond Graph technique to impart an understanding that demonstrates how a variety of disciplines interconnect. He supplies a common terminology and language, and the information is supported with practical examples and several case studies with an emphasis on system thinking. A solutions manual is available upon qualifying course adoption.
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