图书简介
Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.
The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
Key Features:
o It provides a comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging
o Each of the volumes presents the accumulated wisdom and shared perspectives from leading researchers and practitioners in the packaging of electronic components
o It will be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems
Volume 1: Flip-Chip and Underfill Materials and Technology (Pengli Zhu, Gang Li and C P Wong): Electronic Packaging Technology (Pengli Zhu, Daoqiang Daniel Lu, Zhuqing Zhang and Chingping Wong); Underfill (Pengli Zhu, Rong Sun and Chingping Wong); Underfill Materials (Gang Li and Yangyang Sun); Underfill Filling Technology and Reliability Test (Gang Li); Reworkable Underfill (Pengli Zhu, Shijian Luo, Lejun Wang and Haiying Li); New Challenge to Underfills (Pengli Zhu and Tao Zhao); Volume 2: Wire Bonding Technology (Dae Young Jung, Stephen R Cain, William (Bill) T Chen and Bahgat G Sammakia): Introduction to Wire Bond Technology (Dae Young Jung, Stephen R Cain, and William T Chen); The Fundamentals of Wire Bonding (Michael Mayer); Wire Bonding Equipment and Tools (Ivy W Qin and Giyora Gur); Wire Bonding Process (Ivy W Qin); Metallurgical Aspects of Wire Bonds (Junghyun Cho and Maria P C Roma); Progress in Processing and Properties of Fine Bonding Wires (Sarangapani Murali); Encapsulating Plastic Microelectronics (Eric Kuah); The Fabrication Process of Wafers for Wire Bond Pad and Important Aspects (Haile Wilson); Wire Bond Substrates (Charles Arvin, David J Russell, and Haile Wilson); Wire Bond Reliability (Stephen R Cain and Dae Young Jung); Volume 3: Flexible Chip I/O Interconnects (Muhannad S Bakir and Suresh K Sitaraman): Design, Fabrication, and Assembly of 3-Arc-Fan Compliant Interconnects (Philip Y Chung, Wei Chen, Raphael I Okereke, and Suresh K Sitaraman); Mechanical Reliability Assessment of 3-Arc-Fan Compliant Interconnects (Wei Chen, Philip Y Chung, and Suresh K Sitaraman); Mechanically Flexible Interconnects (MFIs) (Chaoqi Zhang and Muhannad Bakir); Mechanically Flexible Interconnects (MFIs) for Interposer Based Large Scale Heterogeneous System (Chaoqi Zhang and Muhannad Bakir); Flexible Interconnect Design Using a Mechanically-focused, Multi-Objective Genetic Algorithm (Joe L Gonzalez, Paul K Jo, Reza Abbaspour, and Muhannad S Bakir); Post-CMOS Fabrication Technology Enabling Simultaneous Fabrication of 3D Solenoidal Micro-inductors and Flexible I/Os (Muneeb Zia, Hanju Oh, and Muhannad S Bakir); Design, Fabrication, and Characterization of Dense Compressible MicroInterconnects (Paul K Jo, Muneeb Zia, Joe L Gonzalez, Hanju O, and Muhannad S Bakir); Heterogeneous Multi-Die Stitching Enabled by Fine-Pitch & Multi-Height Compressible MicroInterconnects (CMIs) (Paul K Jo, Xuchen Zhang, Joe L Gonzalez, Gary S May, and Muhannad S Bakir); Volume 4: Wafer Bonding Technology (Kuan-Neng Chen and Tan Chuan Seng): Polymer Adhesive Bonding (Kuan-Neng Chen); PETEOS Oxide Fusion Bonding Assisted by a High-κ Dielectric Capping Layer (Chuan Seng Tan); Low-κ Oxide Fusion Bonding (Chuan Seng Tan); Metal Bonding: Introduction and Non-Cu-Based (Kuan-Neng Chen); Cu–Cu Direct Bonding (Kuan-Neng Chen); Self-Assembled Monolayer (SAM) Passivation of Copper and Its Application in Wafer Bonding (Chuan Seng Tan); Cu, Sn, and In Low Temperature Bonding (Kuan-Neng Chen); Design and Fabrication of Wafer Level Fine Pitch Cu–Cu Bonding (Chuan Seng Tan); Hybrid Metal/Dielectric Bonding (Kuan-Neng Chen); 3D Integration Scheme Demonstration Using Wafer Bonding (Kuan-Neng Chen); Crystal Resonator Application (Kuan-Neng Chen); Engineered Substrate of Germanium-on-Insulator (GOI) Through Epitaxy, Bonding and Layer Transfer (Chuan Seng Tan); InP to Si Bonding for Photonics Application (Chuan Seng Tan);
Trade Policy 买家须知
- 关于产品:
- ● 正版保障:本网站隶属于中国国际图书贸易集团公司,确保所有图书都是100%正版。
- ● 环保纸张:进口图书大多使用的都是环保轻型张,颜色偏黄,重量比较轻。
- ● 毛边版:即书翻页的地方,故意做成了参差不齐的样子,一般为精装版,更具收藏价值。
关于退换货:
- 由于预订产品的特殊性,采购订单正式发订后,买方不得无故取消全部或部分产品的订购。
- 由于进口图书的特殊性,发生以下情况的,请直接拒收货物,由快递返回:
- ● 外包装破损/发错货/少发货/图书外观破损/图书配件不全(例如:光盘等)
并请在工作日通过电话400-008-1110联系我们。
- 签收后,如发生以下情况,请在签收后的5个工作日内联系客服办理退换货:
- ● 缺页/错页/错印/脱线
关于发货时间:
- 一般情况下:
- ●【现货】 下单后48小时内由北京(库房)发出快递。
- ●【预订】【预售】下单后国外发货,到货时间预计5-8周左右,店铺默认中通快递,如需顺丰快递邮费到付。
- ● 需要开具发票的客户,发货时间可能在上述基础上再延后1-2个工作日(紧急发票需求,请联系010-68433105/3213);
- ● 如遇其他特殊原因,对发货时间有影响的,我们会第一时间在网站公告,敬请留意。
关于到货时间:
- 由于进口图书入境入库后,都是委托第三方快递发货,所以我们只能保证在规定时间内发出,但无法为您保证确切的到货时间。
- ● 主要城市一般2-4天
- ● 偏远地区一般4-7天
关于接听咨询电话的时间:
- 010-68433105/3213正常接听咨询电话的时间为:周一至周五上午8:30~下午5:00,周六、日及法定节假日休息,将无法接听来电,敬请谅解。
- 其它时间您也可以通过邮件联系我们:customer@readgo.cn,工作日会优先处理。
关于快递:
- ● 已付款订单:主要由中通、宅急送负责派送,订单进度查询请拨打010-68433105/3213。
本书暂无推荐
本书暂无推荐