图书简介

About the Editor List of Contributors preface 1. CONNECTORS 1.1. Challenges of Separable Connectors 1.2. Components of a Connector 1.2.1. Contact Springs 1.2.2. Contact Finishes 1.2.2.1. Noble Metal Contact Finishes 1.2.2.2. Non-noble Metal Contact Finishes 1.2.3. Connector Housing 1.2.4. Contact Interface 1.3. Connector Types 1.3.1. Board-to-Board Connectors 1.3.2. Wire/Cable-to-Wire/Cable Connectors 1.3.3. Wire/Cable-to-Board Connectors 1.4. Connector Terminology 2. CONNECTOR HOUSING 2.1. Mechanical Properties 2.2. Electrical Properties 2.3. Flammability 2.4. Temperature Rating 2.5. Housing Materials 2.5.1. Thermoplastic Polymers 2.5.1.1. Polyesters 2.5.1.2. Polyimides, Polyamide-imides, and Polyetherimides 2.5.1.3. Polyphenylene Sulfides 2.5.1.4. Polyether Ether Ketones 2.5.1.5. Liquid-crystalline Polymers 2.5.1.6. Comparison of Thermoplastic Polymers 2.5.2. Thermosetting Polymers 2.5.3. Additives to Housing Materials 2.5.4. Manufacturing of Housing Materials 3. CONTACT SPRING 3.1. Copper Alloys 3.1.1. Unified Number System (UNS) 3.1.2. Properties of Copper Alloys 3.2. Nickel Alloys 3.3. Conductive Elastomers 3.4. Contact Manufacturing 4. CONTACT PLATING 4.1. Noble Metal Plating 4.1.1. Gold 4.1.2. Palladium 4.1.3. Combination of Gold and Palladium 4.2. Non-noble Metal Plating 4.2.1. Silver 4.2.1.1. Characteristics of Silver as a Contact Finish 4.2.1.2. Potential Tarnish-Accelerating Factors 4.2.1.3. Use of Silver in Typical Connectors 4.2.1.4. Managing Silver Corrosion 4.2.2. Silver-Palladium Alloys 4.2.3. Nanocrystalline Silver Alloys 4.2.4. Silver-Bismuth Alloys 4.2.5. Tin 4.2.6. Nickel Contact Finishes 4.3. Underplating 4.4. Plating Process 4.4.1. Electrolytic Plating 4.4.2. Electroless Plating 4.4.3. Cladding 4.4.4. Hot Dipping 5. CONNECTOR INSERTION AND EXTRACTION 5.1. Insertion and Extraction Forces 5.2. Contact Retention 5.3. Contact Force and Deflection 5.4. Contact Wipe 6. CONTACT INTERFACE 6.1. Constriction Resistance 6.2. Contact Resistance 6.3. Other Factors Affecting Contact Resistance 6.4. Current Rating 6.5. Capacitance and Inductance 6.6. Bandpass and Bandwidth 7. THE BACK-END CONNECTION 7.1. Connection Through Soldering 7.2. Press-fit Connection 7.3. Crimping Connection 7.4. Insulation Displacement Connection 8. LOADS AND FAILURE MECHANISMS 8.1. Environmental Loads 8.1.1. Temperature 8.1.2. Vibration Load 8.1.3. Humidity 8.1.4. Contamination 8.1.5. Differential Pressure 8.2. Failure Mechanisms in Electrical Connectors 8.2.1. Silver Migration 8.2.2. Tin Whiskers 8.2.3. Corrosion Failure 8.2.4. Arc Formation 8.2.5. Creep Failure 8.2.6. Wear 8.2.7. Frictional Polymerization 8.3. Case Study by NASA: Electrical Connectors for Spacecraft 9. FRETTING IN CONNECTORS 9.1. Mechanisms of Fretting Failure 9.1.1. Material Factors That Affect Fretting 9.1.1.1. Contact Materials 9.1.1.2. Hardness 9.1.1.3. Surface Finish 9.1.1.4. Frictional Polymerization 9.1.1.5. Grain Size 9.1.1.6. Oxides 9.1.1.7. Coefficient of Friction 9.1.1.8. Electrochemical Factor 9.1.2. Operating Factors That Affect Fretting 9.1.2.1. Contact Load 9.1.2.2. Fretting Frequency 9.1.2.3. Slip Amplitude 9.1.2.4. Electric Current 9.1.3. Environmental Factors That Affect Fretting 9.1.3.1. Humidity 9.1.3.2. Temperature 9.1.3.3. Dust 9.2. Reducing the Damage of Fretting 9.2.1. Lubrication 9.2.2. Improvement in Design 9.2.3. Coatings 10. TESTING 10.1. Dielectric Withstanding Voltage Testing 10.2. Insulation Resistance Testing 10.3. Contact Resistance Testing 10.4. Current Rating 10.5. Electromagnetic Interference and Electromagnetic Compatibility Testing 10.6. Temperature Life Testing 10.7. Thermal Cycling Testing 10.8. Thermal Shock Testing 10.9. Steady-State Humidity Testing 10.10. Temperature Cycling with Humidity Testing 10.11. Corrosion 10.11.1. Dry Corrosion 10.11.2. Creep Corrosion 10.11.3. Moist Corrosion 10.11.4. Fretting Corrosion 10.12. Mixed Flowing Gas Testing 10.12.1. Battelle Labs MFG Test Methods 10.12.2. EIA MFG Test Methods: EIA 364-TP65A 10.12.3. IEC MFG Test Methods: IEC 68-2-60 Part 2 10.12.4. Telcordia MFG Test Methods: Telcordia GR-63-CORE Section 5.5 10.12.5. IBM MFG Test Methods: G1(T) 10.12.6. CALCE MFG Chamber Capability 10.13. Vibration 10.13.1. Mechanical Shock 10.13.2. Mating Durability 10.14. Highly Accelerated Life Testing 10.15. Environmental Stress Screening 11. SUPPLIER SELECTION: RELIABILITY CAPABILITY ASSESSMENT 11.1. Connector Reliability 11.2. Capability Maturity Models 11.3. Key Reliability Practices 11.3.1. Reliability Requirements and Planning 11.3.2. Training and Development 11.3.3. Reliability Analysis 11.3.4. Reliability Testing 11.3.5. Supply-Chain Management 11.3.6. Failure Data Tracking and Analysis 11.3.7. Verification and Validation 11.3.8. Reliability Improvement 11.4. Reliability Capability of an Organization 11.5. The Evaluation Process 12. SELECTING THE RIGHT CONNECTOR 12.1. Connector Requirements Based on Design and Targeted Application 12.2. Mating Cycles 12.3. Current and Power Ratings 12.4. Environmental Conditions 12.5. Termination Types 12.6. Materials 12.6.1. Connector Housing Materials 12.6.2. Connector Spring Materials 12.7. Contact Finishes 12.8. Reliability 12.9. Raw Cables and Assemblies 12.10. Supplier Reliability Capability Maturity 12.11. Connector Selection Team 12.12. Selection of Candidate Parts from a Preferred Parts Database 12.13. Electronic Product Manufacturers’ Parts Databases 12.14. Parts Procurement 12.15. Parts Availability 12.16. High-Speed Connector Selection 12.17. NASA Connector Selection 12.18. Harsh Environment Connector Selection 12.19. Fiber Optic Interconnect Requirements by Market 12.20. High-Power Subsea Connector Selection 12.20.1. Undersea Connector Reliability 12.21. Screening Tests 12.22. Low-Voltage Automotive Single- and Multiple-Pole Connector Validation 12.23. Failure Modes, Mechanisms, and Effects Analysis for Connectors 12.24. Connector Experiments 12.25. Summary 13. SIGNAL CONNECTOR SELECTION 13.1. Issues Involving High-Speed Connectors 13.2. Signal Transmission Quality Considerations 13.2.1. Interconnect Delays 13.2.2. Signal Distortion 13.3. Electromagnetic Compatibility 13.4. Virtual Prototyping 13.4.1. TDR Impedance Measurements 13.4.1.1. Reflection Coefficient 13.4.1.2. TDR Resolution Factors 13.4.1.3. TDR Accuracy Factors 13.5. Vector Network Analyzer 13.6. Simulation Program with Integrated Circuit Emphasis (SPICE) 14. ADVANCED TECHNOLOGY ATTACHMENT CONNECTORS 14.1. ATA Connector and SATA Connector Overview 14.2. History of ATA and SATA 14.3. Physical Description of ATA Connectors, ATA Alternative Connectors, and SATA Connectors 14.4. ATA Standardization and Revisions 14.5. SATA Standardization and Revisions 14.6. SATA in the Future 15. POWER CONNECTORS 15.1. Requirements for Power Connectors 15.2. Power Connector Materials 15.3. Types of Power Connectors 15.4. Power Contact Resistance 15.5. Continuous, Transient, and Overload Current Capacities 15.5.1. Continuous Current Capacity 15.5.2. Transient Current Capacity 15.5.3. Overload Current Capacity 15.6. Current Rating Method 16. ELECTRICAL CONNECTORS FOR UNDERWATER APPLICATIONS 16.1. Background and Terminology 16.1.1. History 16.1.2. Terminology 16.2. Commercial Off-the-Shelf (COTS) Connectors 16.2.1. Rubber-molded 16.2.2. Rigid-shell or Bulkhead Assemblies 16.2.3. Fluid-filled Underwater Mateable 16.2.4. Inductive Coupling 16.2.5. Assemblies (Non-mateable) 16.3. Connector Design 16.3.1. Thermal Design 16.3.2. Electrical Properties 16.3.3. Mechanical Properties 16.3.4. Material Choices 16.3.5. Specifications for Underwater Connectors 16.4. Connector Deployment and Operation 16.4.1. Connection Procedure 16.4.2. Connection Layout 16.4.3. Reliability 16.5. Discussion and Conclusion 17. EXAMPLES OF CONNECTORS 17.1. Amphenol ICC M-Series (TM) 56 Connectors 17.2. Amphenol ICC Paladin (R) Connectors 17.3. Amphenol ICC 3000W EnergyEdge (TM) X-treme Card Edge Series 17.4. Amphenol ICC FLTStack Connectors 17.5. Amphenol ICC HSBridge Connector System 17.6. Amphenol ICC MUSBR Series USB 3.0 Type-A Connectors 17.7. Amphenol ICC Waterproof USB Type-C (TM) Connectors 17.8. Amphenol ICC NetBridge (TM) Connectors 17.9. Amphenol Sine DuraMate (TM) AHDP Circular Connectors 17.10. Amphenol Aerospace MIL-DTL-38999 Series III Connectors 17.11. Fischer Connectors UltiMate (TM) Series Connectors 17.12. Hirose Electric DF50 Series Connectors 17.13. Hirose Electric microSD (TM) Card Connectors 17.14. Molex SAS-3 and U.2 (SFF-8639) Backplane Connectors 17.15. Molex NeoPress (TM) Mezzanine Connectors 17.16. Molex Impel (TM) Plus Backplane Connectors 17.17. Molex EXTreme Guardian (TM) Power Connectors 17.18. Molex Imperium (TM) High Voltage/High Current Connectors 17.19. TE Connectivity Free Height Connectors 17.20. TE Connectivity STRADA Whisper Connectors 17.21. TE Connectivity MULTI-BEAM High-Density (HD) Connectors 17.22. TE Connectivity HDMI (TM) Connectors 17.23. TE Connectivity AMP CT Connector Series 17.24. TE Connectivity Micro Motor Connectors 17.25. TE Connectivity AMPSEAL Connectors 17.26. TE Connectivity M12 X-code Connectors 17.27. TE Connectivity SOLARLOK 2.0 Connectors 17.28. TE Connectivity Busbar Connectors APPENDIX: STANDARDS A.1. Standard References for Quality Management and Assurance A.2. General Specifications for Connectors A.3. Safety-Related Standards and Specifications A.4. Standard References for Connector Manufacturing A.5. Standard References for Socket Material Property Characterization A.6. Standard References for Socket Performance Qualification A.7. Standard References for Socket Reliability Qualification A.8. Other Standards and Specifications A.9. Telcordia A.10. Society of Cable Telecommunications Engineers (SCTE) A.11. Electronic Industries Alliance/Telecommunications Industry Association (EIA/TIA) A.12. International Electrotechnical Commission (IEC) A.12.1 IEC Standards A.12.2 IEC Connectors A13. Military Standards (MIL-STD) A.14. Standards for Space-Grade Connectors

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