Lead-Free Soldering Process Development and Reliability(Quality and Reliability Engineering Series)

无铅焊接工艺开发和可靠性

工程热物理

售   价:
1131.00
发货周期:预计3-5周发货
作      者
出  版 社
出版时间
2020年06月29日
装      帧
精装
ISBN
9781119482031
复制
页      码
512
开      本
15.24 x 22.86 cm.
语      种
英文
综合评分
暂无评分
我 要 买
- +
库存 29 本
  • 图书详情
  • 目次
  • 买家须知
  • 书评(0)
  • 权威书评(0)
图书简介
This book discusses ongoing issues in electronics manufacturing production. Each topic is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to consider. The book gives updates in areas for which research is ongoing, and addresses new topics which are relevant to lead-free soldering. Among the key topics the book highlights are emerging environmental legislation, developments in process engineering, alloys, PCB surface finishes, PCB laminates, reliability assessments and standards. A practicing engineer will find the book of use as it goes into these and other topics in sufficient detail to make it informative and a good practical guide to address issues of concern in these areas.
本书暂无推荐
本书暂无推荐
看了又看
  • 上一个
  • 下一个