SCALING AND INTEGRATION OF HIGH-SPEED ELECTRONICS AND OPTOMECHANICAL SYSTEMS(SELECTED TOPICS IN ELECTRONICS AND SYSTEMS)

高速电子与光学系统的缩放与集成

电子技术

原   价:
1286.00
售   价:
964.00
发货周期:预计3-5周发货
作      者
出  版 社
出版时间
2017年04月19日
装      帧
精装
ISBN
9789813225398
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页      码
152
语      种
英文
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图书简介
Coined as the third revolution in electronics is under way; Manufacturing is going digital, driven by computing revolution, powered by MOS technology, in particular, by the CMOS technology and its development. In this book, the scaling challenges for CMOS: SiGe BiCMOS, THz and niche technology are covered; the first article looks at scaling challenges for CMOS from an industrial point of view (review of the latest innovations); the second article focuses on SiGe BiCMOS technologies (deals with high-speed up to the THz-region), and the third article reports on circuits associated with source/drain integration in 14 nm and beyond FinFET technology nodes. Followed by the last two articles on niche applications for emerging technologies: one deals with carbon nanotube network and plasmonics for the THz region carbon, while the other reviews the recent developments in integrated on-chip nano-optomechanical systems. Key Features: o This book includes a comprehensive review on latest innovations regarding devices and integration challenges in the CMOS industry o The book presented the scaling challenges for CMOS from an industrial point of view, SiGe BiCMOS technologies, circuits for mm-wave and THz applications and process technologies for the 14 nm node and beyond
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