Handbook of 3D Integration - Vol. 4:Design, Test and Thermal Management

3D集成手册 第4卷:设计、测试与热管理

材料科学基础学科

售   价:
1540.00
发货周期:预计3-5周发货
作      者
出  版 社
出版时间
2019年02月01日
装      帧
精装
ISBN
9783527338559
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页      码
488
语      种
英文
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图书简介
This fourth volume of the landmark handbook focuses on the design, testing and thermal management of 3D-integrated devices, both from a technological and a materials science perspective. Edited and authored by key figures from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including the particular challenges and potential. The second part is concerned with the test methods used to assess the quality and reliability of the 3D-integrated devices, while the third and final part deals with thermal management.
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