Practical Guide to the Packaging of Electronics:Thermal and Mechanical Design and Analysis, Third Edition

电子封装实用指南:热与机械设计及分析 第3版

光电子学与激光技术

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1642.00
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作      者
出  版 社
出版时间
2016年07月11日
装      帧
精装
ISBN
9781498753951
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页      码
374
开      本
6-1/8x9-1/4
语      种
英文
版      次
3rd ed.
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图书简介
Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides a basic understanding of electronics packaging design issues, updated to reflect recent developments in the field. Early chapters provide a foundation in heat transfer, vibration, and life expectancy calculations. Topics include modes of heat removal; impact of thermal stresses; vibration and stresses; shock management; mechanical, electrical, chemically induced reliability; and more.
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