图书简介
This text integrates engineering principles with real applications from a systems perspective, providing a framework for developing electronic instrumentation, from hand-held devices to consoles. It offers practical design solutions, describes the interactions, trade-offs, and priorities encountered, and then gives specific examples. It is aimed at senior undergraduates as well as practicing engineers.
Preface; Acknowledgments; Abbreviations; 1: Systems Engineering; 1.1: Introduction; 1.2: Overview of Systems Engineering; 1.3: The Systems Perspective; 1.4: Documentation; 1.5: Concept Development; 1.6: Requirements; 1.7: Design Development; 1.8: Rapid Prototyping and Field Testing; 1.9: Validation, Verification, and Integration; 1.10: Maintenance and Life-Cycle Costs; 1.11: Failure, Iteration, and Judgment; 1.12: Summary; 1.13: Recommended Reading; 1.14: References; 2: Architecting and Engineering Judgment; 2.1: Good Engineering; 2.2: Questions to Ask; 2.3: Architecting; 2.4: Design Concerns and Heuristics; 2.5: Teamwork and Trust; 2.6: A Common Problem: Real-Time Control; 2.7: Case Studies; 2.8: Summary; 2.9: Recommended Reading; 2.10: References; 3: Documentation; 3.1: Don’t Skip This Chapter; 3.2: Types of Documentation; 3.3: Records, Accountability, and Liability; 3.4: Audience; 3.5: Preparation, Presentation, and Preservation; 3.6: Methods; 3.7: Visual Techniques; 3.8: Layout; 3.9: Writing Well; 3.10: Summary; 3.11: Recommended Reading; 3.12: References; 4: The Human Interface; 4.1: Man-Machine Dialgoue and Industrial Design; 4.2: User-Centered Design; 4.3: Five Elements of Successful Design; 4.4: Cognition; 4.5: Ergonomics; 4.6: Utility; 4.7: Principles for Appropriate Operation; 4.8: Image; 4.9: Ownership; 4.10: Practical Applications and System Implications; 4.11: Some Sources of Errors; 4.12: Interface Design Specifications; 4.13: Case Studies; 4.14: Summary; 4.15: Recommended Reading; 4.16: References; 5: Packaging and Enclosures; 5.1: Packaging’s Influence and Its Factors; 5.2: Design for Manufacture, Assembly and Disassembly; 5.3: Wiring; 5.4: Temperature; 5.5: Vibration and Shock; 5.6: Rugged Systems; 5.7: Component Packaging; 5.8: Other Mechanical Issues; 5.9: Case Studies; 5.10: Summary; 5.11: Recommended Reading; 5.12: References; 6: Grounding and Shielding; 6.1: Foundations of Circuit Operation; 6.2: Outline for Grounding and Shielding Design; 6.3: Safety; 6.4: Noise; 6.5: Priniples of Energy Coupling; 6.6: Grounding; 6.7: Filtering; 6.8: Shielding; 6.9: Protecting Against Electrostatic Discharge; 6.10: General Rules for Design; 6.11: Case Study; 6.12: Summary; 6.13: Recommended Reading; 6.14: References; 7: Circuit Design; 7.1: From Symbols to Substance; 7.2: Convert Requirements into Design; 7.3: Reliability; 7.4: Fault Tolerance; 7.5: High-Speed Design; 7.6: Low-Power Design; 7.7: Noise and Error Budgets; 7.8: Standard Data Buses and Networks; 7.9: Reset and Power Failure Detection; 7.10: Interface: Input; 7.11: Interface: Output; 7.12: Breadboards, Evaluation Boards, and Prototypes; 7.13: Summary; 7.14: Recommended Reading; 7.15: References; 8: Circuit Layout; 8.1: Mundane but Necessary Circuit Boards; 8.2: Circuit Boards; 8.3: Component Placement; 8.4: Routing Signal Traces; 8.5: Ground, Returns, and Shields; 8.6: Connectors and Cables; 8.7: Design for Manufacture; 8.8: Testing and Maintenance; 8.9: Summary; 8.10: Recommended Reading; 8.11: References; 9: Power; 9.1: Sources and Requirements; 9.2: Outline for Power Design; 9.3: Buy versus Build; 9.4: Power Conversion Choices; 9.5: Definitions and Specifications; 9.6: Power Distribution; 9.7: Line Conditioning; 9.8: Electromagnetic Distribution; 9.9: Reliability; 9.10: Batteries; 9.11: Other Power Sources; 9.12: Case Studies; 9.13: Summary; 9.14: Recommended Reading; 9.15: References; 10: Cooling; 10.1: Heat Transfer; 10.2: Approach to Thermal Management; 10.3: Mechanisms for Cooling; 10.4: Operating Range; 10.5: Basic Thermal Calculations; 10.6: Cooling Choices; 10.7: Heat Sink Selection; 10.8: Heat Pipes and Thermal Pillows; 10.9: Fans and Forced Air Cooling; 10.10: Liquid Cooling; 10.11: Evaporation and Refrigeration; 10.12: Trade-offs in Design; 10.13: Analysis and Experimentation; 10.14: Case Studies; 10.15: Summary; 10.16: Recommended Reading; 10.17: References; 11: Software; 11.1: Why Software in a Book about Exercises?; 11.2: Types of Software; 11.3: Traditional Software Life Cycle; 11.4: Models, Metrics, and Software Limitations; 11.5: Risk Abatement and Failure Prevention; 11.6: Software Bugs and Testing; 11.7: Good Programming Practice; 11.8: User Interface; 11.9: Embedded, Real-Time Software; 11.10: Case-Studies and Design Examples; 11.11: Summary; 11.12: Recommended Reading; 11.13: References; 12: Debugging and Testing; 12.1: Understand Your Components and Circuits; 12.2: Steps to Debugging; 12.3: Techniques for Troubleshooting; 12.4: Characterization; 12.5: Electromechanical Components; 12.6: Passive Components; 12.7: Active Devices; 12.8: Operational Amplifiers; 12.9: Analog-Digital Conversion; 12.10: Digital Components; 12.11: Case Study: Sensor Calibration; 12.12: Summary; 12.13: Recommended Reading; 12.14: References; 13: Integration, Production, and Logistics; 13.1: Putting It All Together; 13.2: Inspection and Tests of Components; 13.3: Simulation, Protyping, and Testing; 13.4: Integration; 13.5: Validation and Verification; 13.6: Procurement; 13.7: Manufacturing; 13.8: Maintenance and Repair; 13.9: Training; 13.10: Disposal and Environmental Concerns; 13.11: Case Study: Test System for Avionics; 13.12: Summary; 13.13: References; Appendix A: Outline of Milestones and Documents for Developing Electronic Instruments; Appendix B: Design Review Checklists; Appendic C: Software Design Tools; Index
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