Guidebook for Managing Silicon Chip Reliability(Electronic Packaging)

工程热物理

售   价:
1642.00
发货周期:预计5-7周发货
出  版 社
出版时间
1998年12月29日
装      帧
精装
ISBN
9780849396243
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页      码
240
开      本
234x156mm
语      种
英文
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图书简介
Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. This book examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. It provides a framework for how to model the mechanism, test for defects, and avoid and manage damage. The authors focus on device failure and causes, outlines how to establish the specifications defining chip performance, cost, quality, and reliability, and they include an extensive table detailing the types of mechanism failures.
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