Silver Metallization

冶金物理化学

售   价:
884.00
作      者
出  版 社
出版时间
2012年03月31日
装      帧
平装
ISBN
9781849967051
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页      码
123
语      种
英语
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图书简介
Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the issues that have prevented silver from being used as an interconnect metal. The authors provide details on a wide ran
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